SSB Product introduction
Also known as "ESD shielding bag" or "Mylar metallized bag/electroplated bag," the composite structure can also include nylon film (NY or PA).
Application
- Wafer box (wafer cassette)
- Tray
- Tape & reel
- Reticle box
- Printed circuit board (PCB), IC carrier
- IC packaging
- Electrostatic-sensitive electronic components
- Lenses
- Passive components (MLCC)
- Consumer electronics (motherboard, RAM)
Function
- Surface resistivity:10⁸~10¹¹ Ω
- Heat-sealable
- Vacuum-sealable
- Semi-transparent (contents can be identified)
- The color of the metallized layer affects barcode scanning recognition of packaged contents. (This can be improved by affixing labels to the package)
- Customizable printing of patterns and text
- "Surface printing" available: printed patterns and text are easy to identify; however, external forces may scratch and remove them
- "Inner printing" available: printed patterns and text will not fall off; however, the metallized layer may reduce the clarity of patterns and text
- Compliant with EU RoHS (Restriction of Hazardous Substances) and REACH SVHC (Substances of Very High Concern) regulations
- Compliant with Japan SONY SS00259 standard
- Compliant with California Proposition 65
- Discharge Shielding: <20nJ
- Static Decay: <2s
- Standard thickness: 110µ for anti-static nylon metallized bags, 95µ for anti-static metallized bags. (Other thicknesses can be customized)
- Production facility cleanliness: Class 10,000 cleanroom
Anti-static (nylon-included) electroplated bag/metallized bag structure:
Anti-static coating (ESD-A)/polyester film (PET)/aluminum metallization or vapor-deposited aluminum (ML, VM)//nylon film (NY or PA)//low-density polyethylene film (LDPE or LLDPE)/anti-static coating (ESD-B)
Anti-static electroplated bag/metallized bag structure:
Anti-static coating (ESD-A)/polyester film (PET)/aluminum metallization or vapor-deposited aluminum (ML, VM)//low-density polyethylene film (LDPE or LLDPE)/anti-static coating (ESD-B)
ODM& Manufacturing process